Semiconductor packaging continues to develop as the industry matures. QFPs and TSOP moved to BGAs and CSPs, BGAs and CSPs moved to WL-CSP and Flipchip Devices. PGA devices were popular then they went away and then they came back again. Package sizes are always shrinking while the larger packages never go away. This much fluctuation and evolution means the inspection and evaluation needs of this market are always changing and Olympus Micro-Imaging offers a variety of products to meet them all.

QFP and TSOP devices require evaluation and inspection of the leads including but not limited to pitch measurement, height measurement and burr detection.  BGAs, CSPs and WL-CSP require inspection and measurement of the balls and bumps; this includes height, pitch and ball quality. Flipchip devices require ball detection but also IR based measurements to look through the silicon. All of the above require inspection of the package itself and the mark put on the package.

Our stereomicroscopes provide quick inspection of lead, ball and mark quality.  Our BX Compound microscopes are ideal for basic measurements using Olympus Discover Series imaging software. In addition, the BX is available with near-IR and DUV capabilities for expanded capability. The STM6 Measuring Microscope provides quick and accurate measurements in and outside the field of view.  The LEXT Laser Scanning Microscope provides high resolution imaging of the ball or lead for quality, precise measurement of roughness and 3D profiling of the ball or lead. The LEXT-IR Laser Scanning Microscope provides high-resolution inspection and measurement through silicon.