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Olympus Industrial America has launched LEXT, a new Confocal Laser Scanning Microscope designed for sub-micron imaging, with outstanding 0.12um resolution and accurate three-dimensional measurement capability. Magnification power from 120x to 14,400x satisfies the needs of researchers working between the limits of conventional optical microscopes and scanning electron microscopes (SEMs). |
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| Features & Benefits |
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LEXT combines a 408nm laser with optics specifically designed for operation at this wavelength to optimize image quality and limit aberrations. Olympus software provides a simple user interface, fast processing and advanced analysis in a single solution.
Brightfield, Darkfield and Differential Interference Contrast (DIC) Microscopy techniques are possible in both video and laser confocal imaging modes. The new confocal laser DIC mode is especially useful for highlighting subtle textural variations during surface analysis.
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1. Outstanding resolving power
The 408nm laser diode is combined with optics specifically designed for operation at this wavelength to optimise image quality and limit aberrations. The resolving power is enhanced by confocal optics featuring an additional, optimised circular pinhole and a high speed XY scanner developed from Olympus MEMS technology. The result is world-leading plane resolution which clearly resolves patterns of 0.12µm line-width.
Also, the LEXT does not require any sample preparation such as the dicing, cleaving, deposition. Therefore, the LEXT provide the efficient operation superior than the Scanning Electronic Microscopes (SEMs).
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3. High precision 3D measurement
2D measurement: Best suited for measurement of 1.5mm to 1µm widths. Both line-width and geometric measurements (e.g. diameter of a circle) are possible.
3D measurement: Best suited for measurement of 1mm to 0.5µm bumps. A volume, capacity, surface area, etc. can be measured in 3D. The thickness of a thin transparent film can be measured.
Roughness analysis: Best suited for the analysis of roughness of about Rz 0.1µm. Analysis of line and surface roughness is possible. Noncontact probing leaves specimen free of scratches.
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Configure your LEXT OLS3100 System
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For your Industrial Micro-Imaging requirements in North America, please call our Customer Sevices Team to arrange an on-site demonstration, ask for more information at: 866-629-2450 (toll free), or complete the
on-line inquiry form.
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