| Micro Electrical Mechanical Systems (MEMS) devices are designed and constructed using the familiar semiconductor lithography process. Visual inspection is typically performed using a variety of optical tools, from simple high-resolution stereos, such as the Olympus SZX 10 and SZX 16, to automated high magnification compound microscopes with handlers like the MX 61 with AL110 Wafer Loader. Because of their larger scale, MEMS devices lend themselves to three dimension measurements. Unlike the microprocessor market, useful and highly repeatable 3D measurements can be made using a Confocal Laser Scanning Microscope (CLSM) instead of a Scanning Electron Microscope (SEM).
Have you been struggling with a SEM to perform MEMS inspection? Much like conventional optical microscopes, the CLSM provides almost immediate feedback and data from a wide variety of samples. Unlike the SEM, the CLSM does not require special sample preparation (decoration with metals) nor does it require extra time to evacuate the chamber. The CLSM provides an answer seconds after placing the sample on the tool.
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The results from the CLSM can best be viewed using the latest generation tool from Olympus, the LEXT. The LEXT makes easy sample measurement in 2 or 3 axes with a variety of data analysis capabilities. For even greater flexibility, the LEXT can also perform standard optical microscope functions without any impact to its footprint or system performance. Recently an IR version of the LEXT was introduced, which can easily look through silicon and provide valuable alignment information within the MEMS device. |
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